Copper
Copper Powder, 20 um, 99.8 %, Spherical, Electrolytic (ECP) (CU/1992)
SKU CU/1992 · NextGen Materials
Price on requestOn request
Applications
Conductive InksThermal SprayAdditive Manufacturing
Specifications
| Formula | Cu |
|---|---|
| CAS number | 7440-50-8 |
| EC number | 231-159-6 |
| Purity | 99.8 % |
| Particle size | 20 µm |
| Shape | Spherical |
| Morphology | Spherical |
| HS code | 7406.10 |
| UN number | UN3089 |
| Lead time | 1–2 weeks |